LG Innotek recently released a breakthrough chip packaging solution, adopting "Copper Posts" technology, replacing the traditional way of using only solder balls to connect chip substrates and motherboards, allowing smart phones to develop thinner and higher efficiency.
The core of is to first set up a micro copper column on the substrate, and then place a tiny ball at the top of the copper column. In comparison with the traditional direct welding of sibling, the copper column can reduce the distance between sibling balls by about 20%, and the packaging density is higher, which helps reduce the overall volume of the motherboard and makes the space configuration more flexible.
(Source: LG)
In addition, the melting point of the copper is far higher than that of si, which can maintain a stable structure during the high temperature process and avoid deformation and displacement of si balls during welding. In addition, the heat conductivity of the copper is about seven times that of traditional welding sl, which can dissipate heat more quickly and reduce the risk of signal degradation caused by excessive heat.
LG Innotek executive chief Moon Hyuk-soo said: "This technology is not just a simple supply of zero components, but comes from our in-depth thinking about customer success. With this innovation, we will change the existing framework of the substrate industry and continue to create differentiated value for customers."
Although this technology has extremely high potential, it still faces challenges before production. Because the microstructure process has extremely high accuracy requirements, there is a huge challenge in chip integration and production yield. The cost of copper materials is also higher than that of Xi, which also makes the recycling cycle of the overall investment capital a key issue that requires careful evaluation of the industry.
If the technology is mature and smoothly introduced into mass production in the future, LG Innotek's copper column packaging solution is expected to become the key foundation for promoting the innovation of high-efficiency smart phones, and further reshape the competitive picture of the semiconductor packaging industry.
LG Innotek to slim down smartphones by replacing solder balls with copper posts